The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2017
Filed:
Jun. 17, 2015
Seiko Instruments Inc., Chiba-shi, Chiba, JP;
Shinya Kubota, Chiba, JP;
Masaru Akino, Chiba, JP;
Abstract
A resin-encapsulated semiconductor device comprises a semiconductor chip mounted on a die pad. A plurality of leads each having an inner lead and an outer lead are arranged in spaced relation from the die pad with the inner leads facing the die pad. A metal plating layer is formed on top surfaces of the inner leads, and the inner leads are connected by metal wires to the semiconductor chip. An encapsulation resin encapsulates the semiconductor chip, die pad, metal wires and inner leads leaving the outer leads exposed. The outer edge of the metal plating layer coincides with the outer surface of the encapsulation resin and with the outer edge of the metal plating layer.