This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Ebara Corporation. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Innovations of Shinji Omata in Plating Technology
Introduction
Shinji Omata is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of plating technology, particularly through his innovative patent. His work focuses on enhancing the quality of plating processes, which is crucial in various manufacturing applications.
Latest Patents
Shinji Omata holds a patent for a plating apparatus designed to suppress the deterioration of plating quality caused by gas bubbles at the anode. This invention includes a plating module with a plating tank that houses a plating solution. The apparatus features an anode arranged within the tank, a substrate holder that secures the substrate with its surface facing downward, and a membrane module that partitions the tank into an anode chamber and a cathode chamber. The design also incorporates a pipe member that facilitates communication between different regions within the plating tank, ensuring optimal plating conditions.
Career Highlights
Omata is associated with Ebara Corporation, a leading company in the field of environmental and industrial machinery. His work at Ebara has allowed him to focus on innovative solutions that address challenges in plating technology. His dedication to improving plating processes has positioned him as a valuable asset in his field.
Collaborations
Shinji Omata has collaborated with notable colleagues, including Masaki Tomita and Kentaro Yamamoto. These partnerships have fostered a creative environment that encourages the development of advanced technologies in plating.
Conclusion
Shinji Omata's contributions to plating technology through his innovative patent demonstrate his commitment to enhancing manufacturing processes. His work continues to influence the industry, ensuring higher quality standards in plating applications.