The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2026

Filed:

Apr. 21, 2022
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Shinji Omata, Tokyo, JP;

Masaki Tomita, Tokyo, JP;

Kentaro Yamamoto, Tokyo, JP;

Yasuyuki Masuda, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 17/00 (2006.01); C25D 17/02 (2006.01); C25D 17/06 (2006.01); C25D 21/04 (2006.01);
U.S. Cl.
CPC ...
C25D 17/002 (2013.01); C25D 17/02 (2013.01); C25D 17/06 (2013.01); C25D 21/04 (2013.01);
Abstract

Provided is a technique that ensures suppressing deterioration of plating quality of a substrate due to gas bubbles at an anode. A plating moduleincludes a plating tankconfigured to house a plating solution, an anodearranged in the plating tank, a substrate holderconfigured to hold a substrate WF with a surface to be plated facing downward so as to be opposed to the anode, a membrane modulethat includes a first membranepartitioning an inside of the plating tankinto an anode chamberand a cathode chamberand a second membranearranged between the first membraneand the anode, and a pipe membercommunicating between a first region Rbelow the anodein the plating tankand a second region Rbetween the first membraneand the second membrane


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