Shinichi Tokuno

Title: Innovations by Shinichi Tokuno in Semiconductor Technology

Introduction

Shinichi Tokuno is a prominent inventor based in Osaka, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on improving the production methods of semiconductor modules, which are essential components in various electronic devices.

Latest Patents

Among his latest patents is a method of producing a semiconductor module. This innovative method aims to securely ground an exterior shield while reducing the burden imposed on a dicing blade and the exterior shield itself. The process includes a hole-forming step that creates a hole extending from the top surface of a sealing resin layer to a ground wiring provided at a collective substrate. Additionally, a film-forming step involves creating an electrically conductive film that covers the top surface of the sealing resin layer, the internal surface of the hole, and the ground wiring. Finally, a separation step is included to separate multiple individual module sections.

Career Highlights

Shinichi Tokuno is associated with Sharp Kabushiki Kaisha Corporation, where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the efficiency and reliability of semiconductor modules.

Collaborations

He has collaborated with notable coworkers, including Takae Sakai and Masahiro Murakami, contributing to various projects that enhance semiconductor production techniques.

Conclusion

Shinichi Tokuno's contributions to semiconductor technology through his innovative patents reflect his expertise and commitment to advancing the field. His work continues to influence the development of electronic devices worldwide.