The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2015
Filed:
May. 11, 2012
Takae Sakai, Osaka, JP;
Masahiro Murakami, Osaka, JP;
Masahiko Kushino, Osaka, JP;
Yoshihisa Amano, Osaka, JP;
Shinichi Tokuno, Osaka, JP;
Takae Sakai, Osaka, JP;
Masahiro Murakami, Osaka, JP;
Masahiko Kushino, Osaka, JP;
Yoshihisa Amano, Osaka, JP;
Shinichi Tokuno, Osaka, JP;
SHARP KABUSHIKI KAISHA, Osaka, JP;
Abstract
In order to securely ground an exterior shield and reduce burden imposed on a dicing blade and the exterior shield, a method of producing a semiconductor module comprises a hole-forming step of forming a holeextending from a top surface of a sealing resin layerto a ground wiring() provided at a collective substrate, a film-forming step of forming an electrically conductive film made of an electrically conductive material so as to cover at least the top surface of the sealing resin layer, an internal surface of the hole, and the ground wiring(), and a separation step of separating from each other a plurality of individual module sections which the individual module section comprises.