Osaka, Japan

Masahiko Kushino

USPTO Granted Patents = 6 

Average Co-Inventor Count = 2.9

ph-index = 3

Forward Citations = 51(Granted Patents)


Location History:

  • Sakai, JP (1992)
  • Yamatotakada, JP (2003)
  • Osaka, JP (2012 - 2016)

Company Filing History:


Years Active: 1992-2016

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6 patents (USPTO):Explore Patents

Title: Masahiko Kushino: Innovator in Semiconductor Technology

Introduction

Masahiko Kushino is a prominent inventor based in Osaka, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 6 patents. His work focuses on improving the efficiency and reliability of semiconductor modules.

Latest Patents

Kushino's latest patents include a method of producing a semiconductor module. This innovative method aims to securely ground an exterior shield while reducing the burden imposed on a dicing blade and the exterior shield itself. The process involves several steps, including a hole-forming step that creates a hole extending from the top surface of a sealing resin layer to a ground wiring provided at a collective substrate. Additionally, a film-forming step is included, which forms an electrically conductive film made of an electrically conductive material to cover the top surface of the sealing resin layer, the internal surface of the hole, and the ground wiring. Finally, a separation step is performed to separate multiple individual module sections.

Career Highlights

Kushino is currently associated with Sharp Kabushiki Kaisha Corporation, where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor modules, making them more efficient and reliable.

Collaborations

Kushino has collaborated with notable colleagues in his field, including Yoshihisa Amano and Masahiro Murakami. These collaborations have further enhanced his contributions to semiconductor technology.

Conclusion

Masahiko Kushino is a key figure in the semiconductor industry, with a focus on innovative methods for producing semiconductor modules. His patents reflect his commitment to advancing technology and improving the efficiency of electronic components.

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