The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2012
Filed:
Apr. 02, 2010
Mitsuyoshi Yamashita, Osaka, JP;
Yoshihisa Amano, Osaka, JP;
Akiteru Deguchi, Osaka, JP;
Masahiko Kushino, Osaka, JP;
Masahiro Murakami, Osaka, JP;
Mitsuyoshi Yamashita, Osaka, JP;
Yoshihisa Amano, Osaka, JP;
Akiteru Deguchi, Osaka, JP;
Masahiko Kushino, Osaka, JP;
Masahiro Murakami, Osaka, JP;
Sharp Kabushiki Kaisha, Osaka, JP;
Abstract
Provided is an electronic component module which has high reliability and is capable of suppressing reduction in handling performance of a mounting machine. An electronic component module includes a plurality of electronic components mounted on a top surface of a module substrate, a planar top plate covering the electronic components, and a top plate holding member for holding the top plate. The plurality of electronic components include a quartz resonator, and a RF-IC which has a height smaller than that of the quartz resonator and is disposed on the top surface of the module substrate so as to be side by side with the quartz resonator. In addition, the top plate is fixed to the quartz resonator, and the top plate holding member for holding the top plate is disposed between the RF-IC and the top plate.