Takae Sakai

Title: Takae Sakai: Innovator in Semiconductor Technology

Introduction

Takae Sakai is a prominent inventor based in Yao, Japan. She has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. Her innovative work focuses on improving the production methods of semiconductor modules.

Latest Patents

Among her latest patents is a method of producing a semiconductor module. This method aims to securely ground an exterior shield while reducing the burden imposed on a dicing blade and the exterior shield itself. The process includes a hole-forming step that creates a hole extending from the top surface of a sealing resin layer to a ground wiring provided at a collective substrate. Additionally, a film-forming step is involved, where an electrically conductive film made of an electrically conductive material covers the top surface of the sealing resin layer, the internal surface of the hole, and the ground wiring. Finally, a separation step is included to separate multiple individual module sections.

Career Highlights

Takae Sakai is currently employed at Sharp Kabushiki Kaisha Corporation, where she continues to advance her research and development in semiconductor technologies. Her work has been instrumental in enhancing the efficiency and reliability of semiconductor modules.

Collaborations

Throughout her career, Takae has collaborated with notable colleagues, including Nobuyoshi Kaiki and Masahiro Murakami. These collaborations have further enriched her contributions to the field.

Conclusion

Takae Sakai stands out as a leading inventor in semiconductor technology, with her innovative methods paving the way for advancements in the industry. Her dedication to improving production techniques continues to influence the future of semiconductor modules.