Sharp Kabushiki Kaisha Corporation

Shinichi Tokuno

Masahiro Murakami

Yoshihisa Amano

Masahiko Kushino

Takae Sakai

Hiroshi Katayama

In order to securely ground an exterior shield and reduce burden imposed on a dicing blade and the exterior shield, a method of producing a semiconductor module comprises a hole-forming step of forming a holeextending from a top surface of a sealing resin layerto a ground wiring() provided at a collective substrate, a film-forming step of forming an electrically conductive film made of an electrically conductive material so as to cover at least the top surface of the sealing resin layer, an internal surface of the hole, and the ground wiring(), and a separation step of separating from each other a plurality of individual module sections which the individual module section comprises.

Method of producing semiconductor module and semiconductor module

An optical pickup device has first and second light sources that emit first and second laser beams of different wavelengths, an object lens that concentrates the first and second laser beams on a data recording surface of an optical disk, an optical separator disposed between the first and second light sources and the object lens, and an optical monitor that detects a quantity of light of the second laser beam. The optical separator has a wavelength selecting film that, on one hand, reflects the first laser beam emitted from the first light source toward the object lens and, on the other hand, transmits the second laser beam emitted from the second light source to the object lens, and a reflector that reflects a part of the second laser beam emitted from the second light source toward the optical monitor.

Growing community of inventors

Osaka, Japan

Shinichi Tokuno