Company Filing History:
Years Active: 2011-2013
Title: The Innovative Contributions of Shin-Ping Hsu
Introduction
Shin-Ping Hsu is a notable inventor based in Hsin-Chu, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 5 patents. His work focuses on enhancing the structural integrity and functionality of package designs, which are crucial for modern electronic devices.
Latest Patents
Among his latest patents, Hsu has developed a package structure that includes a first carrier board with a through hole and a semiconductor chip secured in position by a fastening member. This design prevents displacement of the semiconductor chip under external forces, ensuring reliability in electronic applications. Another notable patent is his package substrate structure, which features a substrate with wire-bonding pads and ball-implanting pads, along with a cavity that penetrates both surfaces of the substrate. This innovative design incorporates a metal board that enhances the structural integrity of the package while allowing for effective soldering processes.
Career Highlights
Shin-Ping Hsu is currently employed at Unimicron Technology Corporation, a leading company in the semiconductor industry. His work at Unimicron has allowed him to push the boundaries of packaging technology, contributing to advancements that benefit various electronic applications.
Collaborations
Hsu has collaborated with talented coworkers such as Kan-Jung Chia and Chih-Kui Yang. Their combined expertise has fostered an environment of innovation and creativity, leading to the development of cutting-edge technologies in semiconductor packaging.
Conclusion
Shin-Ping Hsu's contributions to the field of semiconductor packaging are noteworthy and impactful. His innovative patents and collaborative efforts continue to shape the future of electronic device manufacturing.