The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2012
Filed:
Jun. 30, 2009
Shin-ping Hsu, Hsin-Chu, TW;
Shin-Ping Hsu, Hsin-Chu, TW;
Unimicron Technology Corp., Taoyuan, TW;
Abstract
A package substrate structure includes: a substrate having a first surface and an opposing second surface and characterized by a plurality of wire-bonding pads provided on the first surface of the substrate, a plurality of ball-implanting pads provided on the second surface of the substrate, and at least a cavity formed to penetrate the first and second surfaces of the substrate; a metal board mounted on the second surface of the substrate and covering the cavity, wherein the metal board has a thickness greater than that of the ball-implanting pads and has an area greater than that of the cavity; and solder masks disposed on the first and second surfaces of the substrate respectively and having at least a solder-mask cavity corresponding in position to the cavity of the substrate, the solder masks further having a plurality of openings for exposing the wire-bonding pads, the ball-implanting pads and the metal board.