The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2013
Filed:
Aug. 24, 2009
Applicants:
Shin-ping Hsu, Hsin-Chu, TW;
Zhao-chong Zeng, Hsin-Chu, TW;
Zhi-hui Yang, Hsin-Chu, TW;
Inventors:
Assignee:
Unimicron Technology Corporation, Taoyuan, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/04 (2006.01);
U.S. Cl.
CPC ...
Abstract
A package structure includes a first carrier board provided with a through hole, at least a filling hole in communication with the through hole, a semiconductor chip received in the through hole, and a fastening member disposed in the filling hole and abutting against the semiconductor chip so as to secure the semiconductor chip in position, thereby preventing the semiconductor chip in the through hole from displacement under an external force.