This inventor holds 3 USPTO granted patents. Top assignee: Kyocera Corporation. Active years: 1996-2001.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1996-2001
Title: The Innovative Contributions of Shin Matsuda
Introduction
Shin Matsuda is a notable inventor based in Kokubu, Japan. He has made significant contributions to the field of semiconductor packaging, holding a total of 3 patents. His work focuses on enhancing the efficiency and reliability of semiconductor elements.
Latest Patents
One of his latest patents is a package for a semiconductor element that features depressions containing solder terminals. This innovative package includes a substrate made of electrically insulating material, which has a semiconductor element-mounting portion on its upper surface. The substrate is designed with multiple depression portions on its lower surface, allowing for a complex arrangement of metallized wiring layers that connect to the semiconductor element. Additionally, connection pads on the bottom surfaces of these depressions are electrically linked to the wiring layers, ensuring effective connectivity. The terminals attached to these connection pads feature a ball-like protruding portion and utilize non-eutectic solder, enhancing the package's performance. Another significant patent involves a method for fabricating a package for housing a semiconductor element, which includes applying solder paste within the depressions of the insulating substrate and mounting solder balls to create robust connection terminals.
Career Highlights
Shin Matsuda is currently employed at Kyocera Corporation, where he continues to innovate in the semiconductor field. His work has contributed to advancements in packaging technology, which is crucial for the performance of electronic devices.
Collaborations
Throughout his career, Matsuda has collaborated with talented individuals such as Nobuyuki Ito and Shingo Sato. These partnerships have fostered a creative environment that encourages innovation and the development of new technologies.
Conclusion
Shin Matsuda's contributions to semiconductor packaging demonstrate his commitment to innovation and excellence in engineering. His patents reflect a deep understanding of the complexities involved in semiconductor technology, making him a valuable asset to the field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile