The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 2001
Filed:
Dec. 06, 1995
Nobuyuki Ito, Kokubu, JP;
Shin Matsuda, Kokubu, JP;
Kyocera Corporation, Kyoto, JP;
Abstract
A package for housing a semiconductor element includes a substrate of electrically insulating material and having a semiconductor element-mounting portion at an upper surface thereof onto which the semiconductor element is mounted. The substrate has a plurality of depression portions at a lower surface thereof, and a plurality of metallized wiring layers lead out from the periphery of the semiconductor element-mounting portion and extend to the bottom surfaces of the depression portions. A plurality of connection pads formed on the bottom surfaces of the depression portions are electrically connected to the metallized wiring layers. Terminals which are attached to the connection pads each have a ball-like protruding portion at the lower surface of the insulating substrate and comprise non-eutectic solder. The package may be provided with metallic pads formed on the lower surface of the insulating substrate, and metallic balls attached to the metallic pads.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile