Osaka, Japan

Shimpei Obata

USPTO Granted Patents = 4 

Average Co-Inventor Count = 4.6

ph-index = 1


Location History:

  • Osaka, JP (2022)
  • Fukushima, JP (2019 - 2024)

Company Filing History:


Years Active: 2019-2024

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4 patents (USPTO):Explore Patents

Title: Innovations of Shimpei Obata

Introduction

Shimpei Obata is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of materials science, particularly in thermosetting resin compositions and printed wiring boards. With a total of 4 patents to his name, Obata continues to push the boundaries of innovation in his industry.

Latest Patents

Obata's latest patents include a thermosetting resin composition, a metal-clad laminated plate, an insulating sheet, a printed wiring board, a method of manufacturing a printed wiring board, and a package substrate. The thermosetting resin composition he developed contains a thermosetting resin component and silica treated with isocyanate, with specific content ranges for optimal performance. His work on prepregs also highlights the importance of reinforcing fibers and resin compositions that achieve high glass transition temperatures.

Career Highlights

Shimpei Obata is currently employed at Panasonic Intellectual Property Management Co., Ltd. His role at the company allows him to leverage his expertise in developing innovative materials that meet the demands of modern technology. His contributions have been instrumental in advancing the capabilities of electronic components.

Collaborations

Obata has collaborated with notable coworkers such as Ryuji Takahashi and Yasunori Hoshino. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Shimpei Obata's work exemplifies the spirit of innovation in the field of materials science. His patents and collaborations reflect a commitment to advancing technology and improving product performance.

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