The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2023

Filed:

Apr. 18, 2017
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Shimpei Obata, Fukushima, JP;

Ryuuji Takahashi, Fukushima, JP;

Yasunori Hoshino, Osaka, JP;

Shigetoshi Fujita, Fukushima, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); B32B 15/08 (2006.01); B32B 5/28 (2006.01); C08J 5/10 (2006.01); C08J 5/24 (2006.01); H01L 23/498 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0373 (2013.01); B32B 5/28 (2013.01); B32B 15/08 (2013.01); C08J 5/10 (2013.01); C08J 5/244 (2021.05); H01L 23/49894 (2013.01); H05K 1/0271 (2013.01); H05K 1/03 (2013.01); H05K 1/0366 (2013.01); B32B 2262/101 (2013.01); B32B 2457/08 (2013.01); C08J 2361/06 (2013.01); C08J 2361/08 (2013.01); C08J 2363/00 (2013.01); C08J 2379/08 (2013.01); C08J 2425/12 (2013.01); C08J 2433/00 (2013.01); C08J 2433/04 (2013.01); C08J 2433/12 (2013.01); C08J 2433/20 (2013.01); C08J 2461/06 (2013.01); C08J 2461/08 (2013.01); C08J 2463/00 (2013.01); C08J 2475/00 (2013.01); C08J 2479/08 (2013.01); C08J 2483/04 (2013.01); H05K 2201/0218 (2013.01); H05K 2201/0227 (2013.01);
Abstract

A prepreg contains a base material containing a reinforcing fiber and a semi-cured product of a resin composition impregnated into the base material containing a reinforcing fiber. The prepreg after cured has a glass transition temperature (Tg) which is higher than or equal to 150° C. and lower than or equal to 220° C. The resin composition contains (A) a thermosetting resin and (B) at least one compound selected from a group consisting of core shell rubber and a polymer component having a weight average molecular weight of 100000 or more. An amount of the (B) component is higher than or equal to 30 parts by mass and lower than or equal to 100 parts by mass with respect to 100 parts by mass of the (A) component.


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