Panasonic Intellectual Property Management Co., Ltd.

Shimpei Obata

Yasunori Hoshino

Ryuji Takahashi

Shigetoshi Fujita

Takahiro Yamada

Hiroyuki Shiraki

Koji Kishino

Hiroki Tamiya

Ryuuji Takahashi

Yasunori Ambe

Shinya Arakawa

Tomo Muguruma

A thermosetting resin composition according to the invention contains: a thermosetting resin component; and silica having an average particle diameter equal to or greater than 0.2 μm and treated with isocyanate. It is preferable that the content of the silica is in a range of 50% by mass to 300% by mass with respect to the thermosetting resin component. It is also preferable that the thermosetting resin composition contains core shell rubber having content in a range of 20% by mass to 80% by mass with respect to the thermosetting resin component.

Thermosetting resin composition, metal-clad laminated plate, insulating sheet, printed wiring board, method of manufacturing printed wiring board, and package substrate

A prepreg contains a base material containing a reinforcing fiber and a semi-cured product of a resin composition impregnated into the base material containing a reinforcing fiber. The prepreg after cured has a glass transition temperature (Tg) which is higher than or equal to 150&#xb0; C. and lower than or equal to 220&#xb0; C. The resin composition contains (A) a thermosetting resin and (B) at least one compound selected from a group consisting of core shell rubber and a polymer component having a weight average molecular weight of 100000 or more. An amount of the (B) component is higher than or equal to 30 parts by mass and lower than or equal to 100 parts by mass with respect to 100 parts by mass of the (A) component.

Prepreg, metal-clad laminated board, and printed wiring board

A thermosetting resin composition contains a thermosetting resin and an inorganic filler. The thermosetting resin includes a curing agent. A 3 mass % methyl ethyl ketone solution of the curing agent has a Gardner color scale of 15 or more. The content of the curing agent accounts for 10 mass % or more of a total solid content of the thermosetting resin composition.

Thermosetting resin composition, prepreg, metal-clad laminate, printed wiring board, film with resin, and metal foil with resin

A prepreg includes: a woven fabric base; and a semi-cured product of a resin composition, which fills an inside of the woven fabric base and coats a surface of the woven fabric base. The resin composition includes a thermosetting resin, an inorganic filler, a first thermoplastic resin soluble in an organic solvent, and a second thermoplastic resin insoluble in an organic solvent. With respect to 100 parts by mass of the thermosetting resin, a content ratio of the inorganic filler ranges from 50 parts by mass to 150 parts by mass, inclusive, and a total content ratio of the first thermoplastic resin and the second thermoplastic resin ranges from 20 parts by mass to 50 parts by mass, inclusive.

Prepreg, metal-clad laminate and printed wiring board

Growing community of inventors

Osaka, Japan

Shimpei Obata