Shih-Pin Hsu

Title: Shih-Pin Hsu: Innovator in Packaging Substrate Technology

Introduction

Shih-Pin Hsu is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of packaging substrate technology. His innovative approach has led to the development of a unique fabrication method that enhances the functionality of electronic components.

Latest Patents

Hsu holds a patent for a "Fabrication method of packaging substrate having embedded passive component." This invention involves a carrier board with two opposite surfaces, where a releasing film and a metal layer are formed on each surface. The metal layers are equipped with positioning pads and are covered with a first hot-melt-dielectric layer that houses a passive component. This component features electrode pads on its upper and lower surfaces. The design includes a core board with a cavity to accommodate the passive component, and a second hot-melt-dielectric layer is stacked on each core board. The layers are heat pressed to create dielectric units, which are then separated from the carrier board. Wiring layers are formed on the surfaces and are electrically connected to the electrode pads.

Career Highlights

Shih-Pin Hsu is currently employed at Unimicron Technology Corporation, where he continues to innovate in the field of electronic packaging. His work has been instrumental in advancing the technology used in modern electronic devices.

Collaborations

Hsu collaborates with Zhao-Chong Zeng, a talented female engineer, contributing to the development of cutting-edge technologies in their field.

Conclusion

Shih-Pin Hsu's contributions to packaging substrate technology exemplify the impact of innovative thinking in the electronics industry. His patent reflects a significant advancement that enhances the integration of passive components in electronic devices.