Location History:
- Pingtung, TW (2005)
- Hsinchu, TW (2004 - 2006)
Company Filing History:
Years Active: 2004-2006
Title: Shih-Liang Chou: Innovator in Semiconductor Technology
Introduction
Shih-Liang Chou is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on innovative processes that enhance the efficiency and effectiveness of semiconductor manufacturing.
Latest Patents
One of his latest patents is a rapid thermal annealing process. This process provides for an RTA equipment that includes a pyrometer for measuring operational parameters, such as temperature. The RTA process involves a first step where a wafer is treated, followed by a comparison of the measured temperature with a reference range. If the measured value falls within the reference range, a second RTA step is applied. If not, the equipment is turned off, and the wafer is transferred to another RTA equipment to complete the process.
Another notable patent is a method of forming an intermetal dielectric layer. This method involves forming at least one metal wire on a substrate, followed by the application of a filling oxide layer. The surface of this layer is smoothed, and two silicon-rich oxide layers are formed on top, which effectively block the diffusion of mobile hydrogen ions.
Career Highlights
Shih-Liang Chou is currently employed at Macronix International Co., Ltd., where he continues to innovate in semiconductor technologies. His work has been instrumental in advancing the capabilities of semiconductor manufacturing processes.
Collaborations
He has collaborated with notable coworkers, including Tsung-De Lin and Wen-Cheng Lien, who contribute to the innovative environment at Macronix International Co., Ltd.
Conclusion
Shih-Liang Chou's contributions to semiconductor technology through his patents and work at Macronix International Co., Ltd. highlight his role as a key innovator in the industry. His advancements in rapid thermal annealing and intermetal dielectric layer formation are paving the way for future developments in semiconductor manufacturing.