Location History:
- Hsinchu, CN (2005)
- Hsinchu, TW (2003 - 2006)
Company Filing History:
Years Active: 2003-2006
Title: Shih-Jye Cheng: Innovator in Semiconductor Technology
Introduction
Shih-Jye Cheng is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of six patents. His innovative work has advanced the methods and materials used in the fabrication of electronic components.
Latest Patents
One of Cheng's latest patents is a method for fabricating an anisotropic conductive substrate. This method involves a back holder with metal pins on its surface. A liquid compound is formed on the surface of the back holder, and the liquid compound is pressed to deform the metal pins into electrodes. The thickness between the upper and lower surfaces of the liquid compound ranges from 25 µm to 250 µm. The electrodes are designed to provide electrical contact for anisotropic conduction. Another notable patent is for a modularized probe head, which is designed for modular assembly on a probe card. This probe head includes a silicon substrate with an active surface and a back surface. The silicon substrate features peripheral bond pads and contact pads, with probing chips mounted on the active surface for testing semiconductor wafers.
Career Highlights
Cheng has worked with notable companies in the semiconductor industry, including Chipmos Technologies Ltd and Chipmos Technologies Inc. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.
Collaborations
Cheng has collaborated with several professionals in his field, including An-Hong Liu and Yeong-Her Wang. Their teamwork has fostered advancements in semiconductor technology and has led to the successful development of new inventions.
Conclusion
Shih-Jye Cheng's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor. His innovative methods continue to shape the future of electronic component fabrication.