The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2005
Filed:
Oct. 08, 2003
Shih-jye Cheng, Hsinchu, TW;
An-hong Liu, Tainan, TW;
Yeong-her Wang, Tainan, TW;
Yeong-ching Chao, Taichung, TW;
Yao-jung Lee, Tainan, TW;
Shih-Jye Cheng, Hsinchu, TW;
An-Hong Liu, Tainan, TW;
Yeong-Her Wang, Tainan, TW;
Yeong-Ching Chao, Taichung, TW;
Yao-Jung Lee, Tainan, TW;
ChipMOS Technologies (Bermuda) Ltd., Hamilton, BM;
ChipMOS Technologies Inc., Hsinchu, TW;
Abstract
A modularized probe head for modularly assembling on a probe card is configured for probing a semiconductor wafer under test. The probe head includes a silicon substrate having an active surface and an opposing back surface. The back surface of the silicon substrate is attached on a holder. The silicon substrate has a plurality of peripheral bond pads and contact pads on its active surface. At least a probing chip is mounted on the active surface of the silicon substrate. The probing chip has probing tips and side electrodes. The side electrodes are connected with the contact pads by means of solder material. The peripheral bonding pads of the silicon substrate are connected with a flexible printed circuit for electrically connecting to a multi-layer printed circuit board of a probe card.