This inventor holds 3 USPTO granted patents and 2 published patent applications. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2017-2018.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2017-2018
Title: Innovations of Shih-Hao Tung in Semiconductor Packaging
Introduction
Shih-Hao Tung is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 3 patents. His work focuses on enhancing the efficiency and reliability of semiconductor packages, which are crucial components in modern electronics.
Latest Patents
One of his latest patents is a fabrication method of a semiconductor package. This innovation includes a packaging substrate with opposite surfaces and conductive pads, designed to encapsulate a chip and conductive posts. The encapsulant features openings that expose the upper surfaces of the conductive posts, thereby increasing package density and protecting the chip from moisture intrusion.
Another significant patent is related to a package on package (PoP) structure and its fabrication method. This method involves creating a first packaging substrate with an electronic element and support portions, encapsulated to prevent bridging between the first and second support portions. This design enhances the functionality and reliability of stacked semiconductor packages.
Career Highlights
Shih-Hao Tung is currently employed at Siliconware Precision Industries Co., Ltd. His work at this company has positioned him as a key player in the semiconductor industry, contributing to advancements that improve electronic device performance.
Collaborations
He collaborates with talented individuals such as Cheng-Chia Chiang and Lung-Yuan Wang, who contribute to the innovative environment at Siliconware Precision Industries Co., Ltd. Their teamwork fosters creativity and leads to groundbreaking developments in semiconductor technology.
Conclusion
Shih-Hao Tung's contributions to semiconductor packaging through his patents demonstrate his expertise and commitment to innovation in the field. His work not only enhances the performance of electronic devices but also sets a foundation for future advancements in semiconductor technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile