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Title: Shigeyasu Itoh: Innovator in Multilayer Wiring Technology
Introduction
Shigeyasu Itoh, an accomplished inventor based in Gifu, Japan, has made significant contributions to the field of multilayer wiring technology. With a total of three patents to his name, he is recognized for his innovative methods that enhance the production and functionality of wiring boards. His work not only addresses industry needs but also incorporates environmental considerations, marking him as a notable figure in modern invention.
Latest Patents
Two of Shigeyasu Itoh's most recent patents emphasize the advancements in wiring board technology. The first is a **Method of Manufacturing Multilayer Wiring Board**, which outlines an innovative approach to creating multilayer wiring boards. This method includes forming grooves for circuits and via holes within an insulating substrate made from a thermoplastic resin that comprises a polyarylketone resin and an amorphous polyetherimide resin, with a melting peak temperature of at least 260°C. Additionally, the method involves embedding a metallic foil which contributes to high-quality wiring circuit formation.
The second patent, the **Semiconductor Device Integrated Multilayer Wiring Board**, presents a highly heat-resistant wiring board capable of low-temperature fusion without resin flow. This design facilitates detailed conductive wiring and allows for the creation of high-density, ultra-small three-dimensional mounting modules. It also includes a method of manufacturing this advanced board, highlighting environmental care and applicability to low volume high mix manufacturing configurations.
Career Highlights
Throughout his career, Shigeyasu Itoh has been associated with prominent companies such as Sony Corporation and Mitsubishi Plastics, Inc. His experiences in these organizations have equipped him with the expertise necessary to conduct groundbreaking research and develop innovative products in the electronics and materials sectors.
Collaborations
Itoh has collaborated with esteemed professionals in his field, such as Minoru Ogawa and Masahiro Izumi. These partnerships have fostered a productive environment for sharing knowledge and driving advancements in technology, showcasing the collaborative aspect of innovation within the industry.
Conclusion
Shigeyasu Itoh's contributions to multilayer wiring technology not only illustrate his inventive talent but also reflect a commitment to environmental sustainability and high-performance manufacturing. With his innovative patents and collaborations, he continues to be a significant figure in the landscape of technological advancement, promising further developments in the future.