The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2008
Filed:
Aug. 24, 2004
Minoru Ogawa, Gifu, JP;
Masahiro Izumi, Gifu, JP;
Shigeyasu Itoh, Gifu, JP;
Shingetsu Yamada, Nagahama, JP;
Shuuji Suzuki, Nagahama, JP;
Hiroo Kurosaki, Nagahama, JP;
Minoru Ogawa, Gifu, JP;
Masahiro Izumi, Gifu, JP;
Shigeyasu Itoh, Gifu, JP;
Shingetsu Yamada, Nagahama, JP;
Shuuji Suzuki, Nagahama, JP;
Hiroo Kurosaki, Nagahama, JP;
Sony Corporation, Tokyo, JP;
Mitsubishi Plastics, Inc., Tokyo, JP;
Abstract
A method of manufacturing a, in order to accommodate the words range and to clarify the multilayer wiring board, grooves for forming a wiring circuit and via holes are formed in an insulating substrate formed from a thermoplastic resin composition comprising a polyarylketone resin with a crystalline melting peak temperature of at least 260° C. and an amorphous polyetherimide resin as the primary constituents, a metallic foil is embedded within the grooves so that the surface of the foil protrudes to the surface of the insulating substrate, and a conductive material formed by curing a conductive paste is used for filling the via holes.