Takatsuki, Japan

Shigeki Mori


Average Co-Inventor Count = 2.5

ph-index = 5

Forward Citations = 73(Granted Patents)


Location History:

  • Takatsuki, JP (1991 - 2000)
  • Osaka, JP (1994 - 2012)

Company Filing History:


Years Active: 1991-2012

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7 patents (USPTO):Explore Patents

Title: Innovations of Shigeki Mori

Introduction

Shigeki Mori is a notable inventor based in Takatsuki, Japan. He has made significant contributions to the field of curable resin compositions, holding a total of seven patents. His work focuses on developing innovative materials that enhance adhesive properties and curing processes.

Latest Patents

One of Mori's latest patents involves a moisture-curing type curable resin composition. This composition contains a curable resin that intramolecularly features a silicon-containing functional group. Additionally, it includes a Lewis acid or a complex of the Lewis acid as a curing catalyst. The Lewis acid is selected from metal halides and boron halides, allowing for rapid curing at room temperature. The silicon-containing functional group is represented by the general formula: —SiXXX or —SiRXX, where X represents a hydrolytic group. If the silicon-containing functional group is —SiRXX, the curable resin further contains a polar component, which can be one of several types of bonds and functional groups. This innovation allows for the creation of a two-part type adhesive by separating the curable resin from the curing catalyst.

Career Highlights

Throughout his career, Shigeki Mori has worked with prominent companies such as Sunstar Kabushiki Kaisha and Konishi Co., Ltd. His experience in these organizations has contributed to his expertise in developing advanced adhesive technologies.

Collaborations

Mori has collaborated with notable coworkers, including Chiho Makino and Yukihiro Nomura. Their combined efforts have led to advancements in the field of curable resins and adhesives.

Conclusion

Shigeki Mori's innovative work in curable resin compositions showcases his expertise and dedication to advancing adhesive technologies. His contributions have the potential to impact various industries that rely on effective bonding materials.

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