The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2009
Filed:
Jul. 16, 2004
Shigeki Mori, Osaka, JP;
Yukihiro Nomura, Saitama, JP;
Kazuhiro Iyo, Osaka, JP;
Shinichi Sato, Saitama, JP;
Shigeki Mori, Osaka, JP;
Yukihiro Nomura, Saitama, JP;
Kazuhiro Iyo, Osaka, JP;
Shinichi Sato, Saitama, JP;
Konishi Co., Ltd., , JP;
Abstract
Disclosed is a moisture-curing type curable resin composition containing: a curable resin intramolecularly having a silicon-containing functional group; and a Lewis acid or a complex of the Lewis acid as a curing catalyst, the Lewis acid being selected from the group consisting of metal halides and boron halides, which is rapidly cured at room temperature. The silicon-containing functional group is represented by general formula: —SiXXXor —SiRXX(wherein, X, Xand Xrespectively represent a hydrolytic group and may be the same as or different from each other, and Rrepresents a substituted or unsubstituted organic group having 1 to 20 carbons). If the silicon-containing functional group is —SiRXX, the curable resin further contains intramolecularly a polar component that is one of urethane, thiourethane, urea, thiourea, substituted urea, substituted thiourea, amide, and sulfide bonds, and hydroxyl, secondary amino and tertiary amino groups. Two-part type adhesive is constitutible with separating the curable resin from the curing catalyst.