Oyama, Japan

Shigeki Ichimura


Average Co-Inventor Count = 5.1

ph-index = 4

Forward Citations = 64(Granted Patents)


Company Filing History:


Years Active: 1994-2001

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4 patents (USPTO):Explore Patents

Title: Shigeki Ichimura: Innovator in Semiconductor Packaging Technology

Introduction

Shigeki Ichimura is a notable inventor based in Oyama, Japan, recognized for his contributions to semiconductor packaging technology. With a total of 4 patents to his name, Ichimura has made significant advancements in the field, particularly in the design and manufacturing processes of semiconductor devices.

Latest Patents

Ichimura's latest patents include a chip supporting substrate for semiconductor packages and a semiconductor device, along with methods for their manufacturing. The first patent describes an innovative insulating film adhesive material that is applied onto wirings in a tent-like formation, creating an empty space that connects to a vent hole. This design enhances the reliability of small-sized semiconductor packages by preventing package cracking and ensuring that gases and water vapor generated during the reflow process are effectively expelled from the package. The second patent outlines a semiconductor packaging chip-supporting substrate that consists of an insulating supporting substrate, wiring, and an insulating film. This configuration includes inner connections to semiconductor chip electrodes and a semiconductor chip-mounting region, ensuring efficient functionality and reliability.

Career Highlights

Throughout his career, Shigeki Ichimura has worked with prominent companies such as Hitachi Chemical Company, Ltd. and Hitachi Co., Ltd. His experience in these organizations has contributed to his expertise in semiconductor technology and innovation.

Collaborations

Ichimura has collaborated with notable colleagues, including Fumio Inoue and Masami Yusa, further enhancing his work in the semiconductor field.

Conclusion

Shigeki Ichimura's innovative patents and career achievements highlight his significant role in advancing semiconductor packaging technology. His contributions continue to influence the industry, ensuring the development of reliable and efficient semiconductor devices.

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