The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 18, 2001
Filed:
Aug. 10, 1999
Applicant:
Inventors:
Masami Yusa, Shimodate, JP;
Toshihiko Kato, Tsukuba, JP;
Fumio Inoue, Tsukuba, JP;
Shigeki Ichimura, Oyama, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/340 ;
U.S. Cl.
CPC ...
H01L 2/340 ;
Abstract
In the present invention, an insulating film adhesive material is attached onto the wirings in the form of a tent so that an empty space communicating with a vent hole is provided. Use of this chip-supporting substrate makes it possible to produce small-sized semiconductor packages preventive of package cracking and having a high reliability, because the function of the vent hole is not damaged and also gases and water vapor which are generated from the insulating film adhesive material at the time of reflowing can be driven off surely outside the package.