Hitachi Chemical Company, Ltd.

Other

Sharp Corporation

Hitachi Co., Ltd

Shigeki Ichimura

Masami Yusa

Fumio Inoue

Yoshiki Sota

Hidehiro Nakamura

Yoshiaki Tsubomatsu

Yorio Iwasaki

Toshio Yamazaki

Koji Miyata

Yasuhiko Awano

Shinsuke Hagiwara

Hiroyuki Kuriya

Toshihiko Kato

In the present invention, an insulating film adhesive material is attached onto the wirings in the form of a tent so that an empty space communicating with a vent hole is provided. Use of this chip-supporting substrate makes it possible to produce small-sized semiconductor packages preventive of package cracking and having a high reliability, because the function of the vent hole is not damaged and also gases and water vapor which are generated from the insulating film adhesive material at the time of reflowing can be driven off surely outside the package.

Chip supporting substrate for semiconductor package, semiconductor device, and method for manufacturing them

A semiconductor packaging chip-supporting substrate of the present invention comprises an insulating supporting substrate, wiring provided on the substrate, and an insulating film provided on the wiring. The wiring each have i) an inner connection that connects to a semiconductor chip electrode and ii) a semiconductor chip-mounting region. An opening is also provided in the insulating supporting substrate at its part where each of the wiring is formed on the insulating supporting substrate, which is the part where an outer connection conducting to the inner connection is provided. The insulating film is formed at the part on which the semiconductor chip is mounted, covering the semiconductor chip-mounting region of the wiring.

Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package

A semiconductor packaging chip-supporting substrate of the present invention comprises an insulating supporting substrate, wiring provided on the substrate, and an insulating film provided on the wiring. The wiring each have i) an inner connection that connects to a semiconductor chip electrode and ii) a semiconductor chip-mounting region. An opening is also provided in the insulating supporting a substrate at its part where each of the wiring is formed on the insulating supporting substrate, which is the part where an outer connection conducting to the inner connection is provided. The insulating film is formed at the part on which the semiconductor chip is mounted, covering the semiconductor chip-mounting region of the wiring.

Substrate for holding a chip of semi-conductor package, semi-conductor

An epoxy resin molding material for sealing of electronic components comprising

Epoxy resin molding material for sealing of electronic component

Growing community of inventors

Oyama, Japan

Shigeki Ichimura