Company Filing History:
Years Active: 2013-2016
Title: Innovations of Inventor Shi-Wei Lee
Introduction
Shi-Wei Lee is a prominent inventor based in Hong Kong, CN. He has made significant contributions to the field of optoelectronics, holding a total of 4 patents. His work focuses on advanced technologies that enhance LED packaging and optoelectronic interconnects.
Latest Patents
One of his latest patents is titled "Submount with cavities and through vias for LED packaging." This invention provides a wafer that includes multiple light-emitting diode (LED) submounts and outlines a method for fabricating these submounts. Each submount features a substrate with through vias, an LED die mounted in a cavity on one side, and a redistribution layer on the opposite side, facilitating efficient connectivity.
Another notable patent is for an "Apparatus having an embedded 3D hybrid integration for optoelectronic interconnects." This invention describes a compact optoelectronic apparatus that integrates a transmitter, receiver, and optical waveguide within a printed circuit board (PCB). The design allows for the stacking of circuit and optical components in a 3D structure, making it suitable for portable products.
Career Highlights
Shi-Wei Lee is affiliated with The Hong Kong University of Science and Technology, where he continues to innovate and contribute to research in optoelectronics. His work has garnered attention for its practical applications in modern technology.
Collaborations
He has collaborated with notable coworkers, including Hon Shing Lau and Matthew Ming Fai Yuen, to advance research and development in his field.
Conclusion
Shi-Wei Lee's contributions to the field of optoelectronics through his innovative patents demonstrate his commitment to advancing technology. His work not only enhances LED packaging but also paves the way for more compact and efficient optoelectronic devices.