The Hong Kong University of Science and Technology

Shi-Wei Lee

Matthew Ming Fai Yuen

Jingshen Wu

Haibin Chen

Haibo Fan

Rong Zhang

Chi Chuen Lo

Hon Shing Lau

Wing Shan Kwong

Wai Fong Lai

Wai Lam Cheng

Kin Ho Poon

Shuk Fan Siu

A wafer having a plurality of light-emitting diode (LED) submounts and a method for fabricating an LED submount are provided. Each of the plurality of LED submounts of the wafer includes: a substrate (), including through vias (); an LED die () mounted in a cavity () on a first side of the substrate () and connected to the through vias (); a redistribution layer () attached to a second side of the substrate () connected to the LED die () through the through vias (). The method includes providing a wafer as a substrate (); providing a cavity () in the substrate () on a first side of the substrate (); providing through vias () in the substrate (), providing a redistribution layer () on the second side of the substrate (), and mounting an LED () in the cavity (), wherein the LED die () is connected to the redistribution layer () through the through vias ().

Submount with cavities and through vias for LED packaging

An optoelectronic apparatus is described herein, including a transmitter, a receiver, and an optical waveguide, all of which are embedded in a PCB. The transmitter includes a laser generator and other circuits for generating electrical and optical signals, which are transmitted through the waveguide to the receiver. The receiver includes circuits and detectors for detecting and converting the optical signals to electrical signals. The circuit and optical components of the transmitter and receiver are integrated in 3D hybrid chip sets where the chip components are stacked in a 3D structure. Because all of the circuit and optical components are embedded in the PCB, the apparatus is made very compact and suitable for implementation in portable products.

Apparatus having an embedded 3D hybrid integration for optoelectronic interconnects

A light tube for producing light, which may be used in the light fittings, desk lamps, vehicle lights etc. The light tube comprises a plurality of segments arranged end to end along the end of the light tube. Each segment has a transparent or translucent rodhaving two ends, a head spreaderby at least one of said ends and an LEDmounted to each heat spreaderfor directing light laterally into the rod. The heat spreadersare mounted to a metal jacketfor dissipating heat. The light tube further comprises one or more reflectorsfor reflecting light out of the light tube.

Light tube

An apparatus having a three-dimensional integrated circuit structure is described herein. The apparatus include an interposer for carrying a plurality of high and low-power chips. The high-power chips are attached and connected to one side of the interposer, while the low-power chips are attached and connected to the other side of the interposer. In generally, the high-power chips produce more heat than does the low-power chip during their operations. The interposer further include through silicon vias and redistribution layers for connecting the chips on both surfaces. In addition, the interposer assembly is attached and connected to a substrate layer, which is in turn attached and connected to a printed circuit board. In order to provide improve thermal management, the interposer surface carrying the high-power chips are oriented away from the circuit board. A heat spreader is attached to the back sides of the high-power chips for dissipating the heat.

Apparatus having thermal-enhanced and cost-effective 3D IC integration structure with through silicon via interposers

Growing community of inventors

Hong Kong, China

Shi-Wei Lee