The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2013
Filed:
Feb. 19, 2010
Hon Shing Lau, Palo Alto, CA (US);
Shi-wei Lee, Hong Kong, CN;
Matthew Ming Fai Yuen, Hong Kong, CN;
Jingshen Wu, Hong Kong, CN;
Chi Chuen Lo, Hong Kong, CN;
Haibo Fan, Hong Kong, CN;
Haibin Chen, Hong Kong, CN;
Hon Shing Lau, Palo Alto, CA (US);
Shi-Wei Lee, Hong Kong, CN;
Matthew Ming Fai Yuen, Hong Kong, CN;
Jingshen Wu, Hong Kong, CN;
Chi Chuen Lo, Hong Kong, CN;
Haibo Fan, Hong Kong, CN;
Haibin Chen, Hong Kong, CN;
The Hong Kong University of Science and Technology, Hong Kong, CN;
Abstract
An apparatus having a three-dimensional integrated circuit structure is described herein. The apparatus include an interposer for carrying a plurality of high and low-power chips. The high-power chips are attached and connected to one side of the interposer, while the low-power chips are attached and connected to the other side of the interposer. In generally, the high-power chips produce more heat than does the low-power chip during their operations. The interposer further include through silicon vias and redistribution layers for connecting the chips on both surfaces. In addition, the interposer assembly is attached and connected to a substrate layer, which is in turn attached and connected to a printed circuit board. In order to provide improve thermal management, the interposer surface carrying the high-power chips are oriented away from the circuit board. A heat spreader is attached to the back sides of the high-power chips for dissipating the heat.