The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2016
Filed:
Jun. 01, 2012
Shi-wei Lee, Hong Kong, CN;
Rong Zhang, Hong Kong, CN;
Shi-Wei Lee, Hong Kong, CN;
Rong Zhang, Hong Kong, CN;
The Hong Kong University of Science and Technology, Hong Kong, CN;
Abstract
A wafer having a plurality of light-emitting diode (LED) submounts and a method for fabricating an LED submount are provided. Each of the plurality of LED submounts of the wafer includes: a substrate (), including through vias (); an LED die () mounted in a cavity () on a first side of the substrate () and connected to the through vias (); a redistribution layer () attached to a second side of the substrate () connected to the LED die () through the through vias (). The method includes providing a wafer as a substrate (); providing a cavity () in the substrate () on a first side of the substrate (); providing through vias () in the substrate (), providing a redistribution layer () on the second side of the substrate (), and mounting an LED () in the cavity (), wherein the LED die () is connected to the redistribution layer () through the through vias ().