Shenghua Li

Title: Innovations of Shenghua Li in Electroless Plating Technologies

Introduction

Shenghua Li is a notable inventor based in Niigata, Japan. He has made significant contributions to the field of electroless plating, holding a total of 3 patents. His work focuses on developing stable and efficient plating solutions that enhance the quality and performance of electronic materials.

Latest Patents

One of Shenghua Li's latest patents is a catalyst solution for electroless plating. This invention relates to a stable palladium ion catalyst aqueous solution that does not utilize boric acid and can be used effectively over a wide pH range. The catalyst solution comprises palladium ion, a palladium ion complexing agent, and a specific amine compound, making it alkaline.

Another significant patent involves a tin or tin alloy plating liquid. This innovative solution allows for the formation of a sufficient plated deposit in openings without causing burns on the plated film surface or abnormal deposits. By adding a specific α, β-unsaturated carbonyl compound to the tin or tin alloy plating liquid, the resulting solution exhibits excellent via filling performance, significantly reducing voids and burns on the deposit surface.

Career Highlights

Shenghua Li is currently employed at Rohm & Haas Electronic Materials LLC, where he continues to advance his research and development in plating technologies. His work has been instrumental in improving the efficiency and reliability of electronic components.

Collaborations

Shenghua Li collaborates with esteemed colleagues such as Hiroki Okada and Makoto Kondo, contributing to a dynamic research environment that fosters innovation and technological advancement.

Conclusion

Shenghua Li's contributions to electroless plating technologies demonstrate his commitment to innovation in the field. His patents reflect a deep understanding of the challenges in plating processes and offer practical solutions that enhance the quality of electronic materials.