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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9926637 B1

PDFFull Text
Date of Patent:
Mar. 27, 2018

Filed:

Dec. 17, 2015

Tin or tin alloy plating liquid

Applicant:

Rohm and Haas Electronic Materials Llc, Marlborough, MA (US);

Inventors:

Hiroki Okada, Niigata, JP;

Shenghua Li, Niigata, JP;

Makoto Kondo, Saitama, JP;

Assignee:

Rohm and Haas Electronic Materials LLC, Marlborough, MA (US);

Attorney:

John J. Piskorski

Primary Examiner:

Louis J Rufo

Int. Cl.
CPC ...
C25D 3/32 (2006.01); C25D 3/60 (2006.01); C25D 5/02 (2006.01); C25D 7/12 (2006.01); H01L 21/288 (2006.01); H01L 21/768 (2006.01); H05K 3/40 (2006.01); C23C 8/16 (2006.01); H05K 3/18 (2006.01); H05K 3/42 (2006.01); C23C 18/16 (2006.01);
U.S. Cl.
CPC ...
C25D 3/32 (2013.01); C25D 3/60 (2013.01); C25D 5/022 (2013.01); C25D 7/123 (2013.01); H01L 21/2885 (2013.01); H01L 21/76879 (2013.01); H05K 3/4007 (2013.01); C23C 18/1605 (2013.01); C23C 18/1653 (2013.01); H05K 3/187 (2013.01); H05K 3/423 (2013.01); H05K 2201/0305 (2013.01); H05K 2201/0367 (2013.01); H05K 2201/09563 (2013.01);
Abstract

Tin or tin alloy plating liquid with a sufficient plated deposit can be formed in the opening without causing burns on the plated film surface or abnormal deposits, and which has a good via filling effect. When a specific α, β-unsaturated carbonyl compound is added into the tin or tin alloy plating liquid, the plating liquid with good via filling performance can be obtained, and the deposit which is substantially free of voids and burns or abnormal deposits on the deposit surface are reduced.

Find Patent Forward Citations

Okada, Hiroki. (2018). Tin or tin alloy plating liquid (U.S. Patent No. 9926637). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9926637

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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