Rohm & Haas Electronic Materials LLC

Shenghua Li

Hiroki Okada

Makoto Kondo

Shinjiro Hayashi

The present invention relates to a stable palladium ion catalyst aqueous solution for electroless metal plating that does not use boric acid and can be used stably over a wide pH range. The catalyst solution for electroless plating of the present invention contains palladium ion, palladium ion complexing agent, and a specific amine compound and is alkaline.

Catalyst solution for electroless plating

Tin or tin alloy plating liquid with a sufficient plated deposit can be formed in the opening without causing burns on the plated film surface or abnormal deposits, and which has a good via filling effect. When a specific &#x3b1;, &#x3b2;-unsaturated carbonyl compound is added into the tin or tin alloy plating liquid, the plating liquid with good via filling performance can be obtained, and the deposit which is substantially free of voids and burns or abnormal deposits on the deposit surface are reduced.

Tin or tin alloy plating liquid

A cyanide-free tin alloy plating solution having outstanding serial stability as well as a method of precipitating tin alloy plating onto an electroconductive object using the tin alloy plating solution is disclosed. The tin alloy plating solution contains tin ions and one or more additional metal ions of silver, copper, bismuth, indium, palladium, lead, zinc, or nickel, and peptides with cysteine residues.

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Niigata, Japan

Shenghua Li