Hsinchu, Taiwan

Sheng-Yuan Lin

This inventor holds 32 USPTO granted patents and 13 published patent applications, primarily in Semiconductor Processing. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2002-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sheng-Yuan Lin. Retrieved from https://idiyas.com/inventor/sheng-yuan-lin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 32 

% Patents Active = 87.5

Average Co-Inventor Count = 5.0

ph-index = 5

Forward Citations = 248(Granted Patents)


Location History:

  • Nan-Tou, TW (2002)
  • Hsin-Chu, TW (2009 - 2024)
  • Hsinchu, TW (2024)

Company Filing History:


Years Active: 2002-2026

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Areas of Expertise:
Semiconductor Substrate
Wafer Processing
Bonding Tool
Acid Etch
Wafer Shift Detection
Deposition Process
Transfer Blade
Pellicle Frame
Integrated Circuit
Heat Spreader
Through-Silicon Vias
Connect Structure
32 patents (USPTO):Explore Patents

Title: Innovations and Contributions of Sheng-Yuan Lin in Semiconductor Technology

Introduction

Sheng-Yuan Lin, based in Hsin-Chu, Taiwan, is a prominent inventor with a remarkable portfolio of 22 patents. His innovative work significantly contributes to the field of semiconductor technology, focusing on improving various manufacturing processes.

Latest Patents

Among his latest inventions, Lin has developed two notable patents. The first, titled "Methods and systems for improving fusion bonding," outlines a technique that employs plasma treatment on a substrate before fusion bonding. This method retains residual charge on the substrate, which is critical as it enhances the quality of fusion bonds between substrates. A novel approach is implemented through an electrically conductive silicone cushion, ensuring consistent charge dissipation during production. The second patent, "Pellicle frame with stress relief trenches," addresses the structural integrity of photomask assemblies. By incorporating stress relief trenches in the pellicle frame, Lin’s design mitigates potential damage due to deformation, thereby ensuring better performance and longevity of the photomasks.

Career Highlights

Sheng-Yuan Lin's career is marked by his association with Taiwan Semiconductor Manufacturing Company Ltd. (TSMC), the world's leading semiconductor foundry. His expertise in fusion bonding and photomask technology has positioned him as a leader in innovative solutions within the semiconductor manufacturing sector.

Collaborations

Throughout his career, Lin has collaborated with esteemed colleagues, including Yuan-Hsin Chi and Chuan-Yi Lin, who share a mutual commitment to advancing semiconductor technologies. This collaborative spirit fosters a rich environment for innovation and development of cutting-edge solutions in the industry.

Conclusion

With a strong foundation in semiconductor technology and an impressive array of patents, Sheng-Yuan Lin exemplifies the spirit of innovation. His contributions are paving the way for enhanced production methods, showcasing the importance of research and development in driving technological advancements within the semiconductor field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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