This inventor holds 1 USPTO granted patent and 6 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Sheng-Kai Chang and Semiconductor Packaging Innovation.
Introduction
Sheng-Kai Chang is an inventor based in Taipei, Taiwan. His listed patent work concerns advanced semiconductor packaging and a chip-on-wafer-on-board structure.
Latest Patents
Chang is associated with 1 patent: “Chip-on-Wafer-on-Board Structure Using Spacer Die and Methods of Forming the Same.” The disclosed structure includes an interposer with bump structures, semiconductor dies connected to some of those bumps, and transistor-free spacer dies connected to others. A molding compound die frame laterally surrounds the semiconductor and spacer dies. The semiconductor dies contain transistors and metal interconnect structures, while the spacer dies do not contain transistors.
Career Highlights
Chang is associated with Taiwan Semiconductor Manufacturing Company Limited. His listed patent reflects work on semiconductor structures and packaging methods that integrate functional dies and spacer dies on an interposer.
Collaborations
Leo Li is identified as Chang’s coworker. The available information does not specify their roles or describe a particular joint project.
Conclusion
Sheng-Kai Chang’s listed invention addresses semiconductor packaging through an interposer-based design that combines active semiconductor dies with transistor-free spacer dies.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile