This inventor holds 2 USPTO granted patents and 2 published patent applications. Top assignee: Chipbond Technology Corporation. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Innovations of Sheng-Jen Wu in Flip Chip Bonding Technology.
Introduction
Sheng-Jen Wu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of flip chip bonding methods. His innovative approach has led to advancements that enhance the efficiency and performance of electronic devices.
Latest Patents
One of Sheng-Jen Wu's key patents is titled "Flip chip bonding method and chip used therein." This patent describes a bonding process where a chip is attached to contact pads of a substrate using composite bumps. Each composite bump consists of a raiser, a UBM layer, and a bonding layer. The process ensures that the bonding surface has a greater area than the surface to be bonded, which effectively reduces electrical impedance between the chip and the substrate. This innovation is crucial for improving the reliability and performance of electronic components.
Career Highlights
Sheng-Jen Wu is associated with Chipbond Technology Corporation, where he applies his expertise in semiconductor manufacturing. His work has been instrumental in developing advanced bonding techniques that are widely used in the industry. With a total of 1 patent, he continues to push the boundaries of technology in his field.
Collaborations
Sheng-Jen Wu collaborates with talented professionals such as Fei-Jain Wu and Hsueh-Shun Yeh. Their combined efforts contribute to the ongoing innovation and development of cutting-edge technologies in semiconductor applications.
Conclusion
In summary, Sheng-Jen Wu's contributions to flip chip bonding technology have made a significant impact on the semiconductor industry. His innovative methods and collaborative spirit continue to drive advancements in electronic device manufacturing.