Shen-Yu Huang

Title: Innovations of Shen-Yu Huang

Introduction

Shen-Yu Huang is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 6 patents. His work focuses on innovative methods for co-designing flip-chip technologies, which are crucial for modern electronic devices.

Latest Patents

One of his latest patents is titled "Method for co-designing flip-chip and interposer." This invention provides a comprehensive approach to obtaining information regarding I/O pads, power pins, and IR constraints of the flip-chip. The method includes a bump planning procedure that determines the total number of micro bumps and the minimum conductance of each power pin based on the bump placement. Another notable patent is "Method and apparatus for flip chip packaging co-design and co-designed flip chip package." This invention outlines a systematic process for I/O pad placement and bump pad planning, ensuring efficient integration between chips and PCBs.

Career Highlights

Shen-Yu Huang is currently employed at MediaTek Corporation, a leading global semiconductor company. His expertise in flip-chip technology has positioned him as a key player in the development of advanced packaging solutions. His innovative approaches have not only enhanced the performance of electronic devices but have also contributed to the overall advancement of the semiconductor industry.

Collaborations

Throughout his career, Shen-Yu Huang has collaborated with talented individuals such as Jia-Wei Fang and Chi-Jih Shih. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Shen-Yu Huang's contributions to the field of semiconductor packaging through his innovative patents and collaborations highlight his importance as an inventor. His work continues to influence the industry and pave the way for future advancements in technology.