The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2016

Filed:

Mar. 02, 2015
Applicant:

Mediatek Inc., Hsin-Chu, TW;

Inventors:

Jia-Wei Fang, Hsinchu, TW;

Shen-Yu Huang, Taipei, TW;

Assignee:

MEDIATEK INC., Science-Based Industrial Park, Hsin-Chu, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/528 (2006.01); H01L 23/488 (2006.01);
U.S. Cl.
CPC ...
H01L 24/17 (2013.01); H01L 23/5283 (2013.01); H01L 24/11 (2013.01); H01L 2224/17177 (2013.01);
Abstract

The present invention provides a flip chip scheme and a method of forming the flip chip scheme. The flip chip scheme comprises: a plurality of bumps, some of the bumps arranged in a first pattern, respectively, and some of the bumps arranged in a second pattern different from the first pattern, respectively; wherein the first pattern is an equilateral triangle arranged by three bumps, and the second pattern is a square arranged by four bumps. The method comprises: arranging some of the bumps in a first pattern, respectively, and arranging some of the bumps in a second pattern different from the first pattern, respectively; wherein the first pattern is an equilateral triangle arranged by three bumps, and the second pattern is a square arranged by four bumps.


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