Shaw Fong Wong

Title: **Shaw Fong Wong: Innovator in Wafer and IC Package Technologies**

Introduction

Shaw Fong Wong is a notable inventor based in Penang, Malaysia. With two patents to his name, he has made significant contributions to the fields of semiconductor technology, particularly in wafer handling and integrated circuit packaging.

Latest Patents

Wong's latest innovations include a **Contactless Wafer Separator** and a **Lower IC Package Structure**. The Contactless Wafer Separator patent describes a wafer container designed for transporting multiple wafers. The housing allows for stacking wafers in a first direction, while the wafer separator rings encircle each wafer in a second direction that is perpendicular to the first. This design includes features like a thickness of 0.3 mm to 1.4 mm and an inner diameter greater than 300 mm, ensuring that the separator rings maintain a precise spacing from the wafers they encircle.

Additionally, his patent for the Lower IC Package Structure is crucial for creating a package-on-package (PoP) assembly. This structure contains an interposer with pads that mate with the terminals of an upper IC package, allowing for an efficient coupling. The encapsulant material positioned in the lower IC package enhances the protection around the integrated circuit die. This innovative design is poised to advance the development of computing systems through its integration on circuit boards.

Career Highlights

Wong has developed these patents while working at **Intel Corporation**, a leading technology company renowned for its contributions to computing and semiconductor innovation. His work at Intel has placed him at the forefront of cutting-edge technological advancements in the industry.

Collaborations

Throughout his career, Shaw Fong Wong has collaborated with talented colleagues, including Wei Keat Loh and Kang Eu Ong. These partnerships have fostered a creative environment that encourages innovation and the development of groundbreaking technologies in semiconductor design and manufacturing.

Conclusion

Shaw Fong Wong stands out as an accomplished inventor whose contributions are shaping the future of semiconductor technology. With his latest patents, he continues to push the boundaries of innovation in wafer and IC package structures, making notable strides in enhancing the efficiency and functionality of modern computing systems.