The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2023

Filed:

Sep. 21, 2021
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Varshalaxmi Bhatt Dhruvkumar, Kedah, MY;

John Biggs, Queen Creek, AZ (US);

Shaw Fong Wong, Pulau Pinang, MY;

Assignee:

INTEL CORPORATION, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/677 (2006.01); B65G 57/03 (2006.01); B65G 57/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67781 (2013.01); B65G 57/005 (2013.01); B65G 57/03 (2013.01); H01L 21/67766 (2013.01);
Abstract

The present disclosure is directed to a wafer container including: a housing configured for transporting a plurality of wafers, wherein the plurality of wafers are stacked on a base of the housing in a first direction; a plurality of wafer separator rings; each of the wafer separator rings configured to encircle a wafer of the plurality of wafers in a second direction that is substantially perpendicular to the first direction, each of the wafer separator rings including a top surface and a bottom surface, defining a thickness there between extending in the first direction, which is about 0.3 mm-1.4 mm; and each of the wafer separator rings including an inner side wall and an outer side wall defined by an inner diameter and an outer diameter, respectively, in the second direction, wherein the inner diameter of the wafer separator ring is greater than 300 mm and configured to be spaced apart from the wafer it is encircling.


Find Patent Forward Citations

Dhruvkumar, Varshalaxmi. (2023). Contactless wafer separator (U.S. Patent No. 11664257). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11664257

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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