Bengaluru, India

Shankara Venkatraman Gopalan

This inventor holds 4 USPTO granted patents. Top assignees: Intel Corporation, Sandisk Technologies Inc., Western Digital Technologies, Inc.. Active years: 2020-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shankara Venkatraman Gopalan. Retrieved from https://idiyas.com/inventor/shankara-venkatraman-gopalan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.7

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2020-2026

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4 patents (USPTO):Explore Patents

Title: Shankara Venkatraman Gopalan: Innovator in Semiconductor Technology

Introduction

Shankara Venkatraman Gopalan is a notable inventor based in Bengaluru, India. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on improving the efficiency and reliability of electronic devices.

Latest Patents

One of his latest patents is a semiconductor device package with coupled substrates. This innovation includes a first substrate extending along a first central plane and a second substrate that is electrically connected to the first substrate. The second substrate extends along a second central plane that is substantially parallel with and offset from the first central plane. This design allows for one or more capacitors to be electrically and mechanically connected to the second substrate via leads, reducing the complexity and manufacturing time of the semiconductor device package.

Another significant patent is for a protective enclosure for an electronic device, specifically for a PCB assembly such as a solid-state drive. This enclosure features a flexible, stamped-metal heat spreader connected to packaged integrated circuits on one side of the PCB assembly. The arrangement of the PCB assembly, heat spreader, and various thermal interface materials significantly lowers the risk of solder-joint failure under thermal cycling.

Career Highlights

Shankara has worked with prominent companies in the technology sector, including Intel Corporation and Western Digital Technologies, Inc. His experience in these organizations has allowed him to develop and refine his innovative ideas in semiconductor technology.

Collaborations

Throughout his career, Shankara has collaborated with talented individuals such as Prasanna Pichumani and Rajeev Rema Shanmugam. These collaborations have contributed to the advancement of his projects and innovations.

Conclusion

Shankara Venkatraman Gopalan is a distinguished inventor whose work in semiconductor technology has led to valuable patents that enhance electronic device performance. His contributions continue to influence the industry and pave the way for future innovations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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