Shang-Kun Huang

Title: Innovations by Inventor Shang-Kun Huang

Introduction

Shang-Kun Huang is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding two patents that showcase his innovative approach to electronic components.

Latest Patents

One of his latest patents is related to semiconductor packages. This patent describes a semiconductor package that includes an electrical connection structure. The structure consists of a first conductive layer, a second conductive layer on top of the first, and a conductive cap positioned between the two layers. The conductive cap is designed to have a hardness greater than that of the first conductive layer. Another significant patent by Huang focuses on a method for manufacturing a semiconductor device. This method involves providing a first electronic component with a first metal contact and a second electronic component with a second metal contact. The process includes changing the lattice of the first metal contact and bonding it to the second metal contact under specific pressure and temperature conditions.

Career Highlights

Shang-Kun Huang has worked with Advanced Semiconductor Engineering, Inc., a prominent company in the semiconductor industry. His experience at this company has allowed him to develop and refine his innovative ideas in semiconductor technology.

Collaborations

Throughout his career, Huang has collaborated with notable colleagues, including Yong-Da Chiu and Ying-Ta Chiu. These collaborations have likely contributed to the advancement of his projects and patents.

Conclusion

Shang-Kun Huang's work in semiconductor technology exemplifies his innovative spirit and dedication to advancing electronic components. His patents reflect a deep understanding of the complexities involved in semiconductor manufacturing and design.