The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2018
Filed:
Feb. 27, 2017
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
National Chung Hsing University, Taichung, TW;
Ying-Ta Chiu, Kaohsiung, TW;
Shang-Kun Huang, Kaohsiung, TW;
Yong-Da Chiu, Kaohsiung, TW;
Jenn-Ming Song, Taichung, TW;
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
NATIONAL CHUNG HSING UNIVERSITY, Taichung, TW;
Abstract
The present disclosure relates to a method for manufacturing a semiconductor device. The method includes providing a first electronic component including a first metal contact and a second electronic component including a second metal contact, changing a lattice of the first metal contact, and bonding the first metal contact to the second metal contact under a predetermined pressure and a predetermined temperature.