Company Filing History:

4 out of 993

Novellus Systems Incorporated

patents

Years Active: 2008-2012

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4 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8308931 - Method and apparatus for electroplating (2012-11-13),

2. 7799684 - Two step process for uniform across wafer deposition and void free filling on ruthenium coated wafers (2010-09-21),

3. 7442267 - Anneal of ruthenium seed layer to improve copper plating (2008-10-28),

4. 7405157 - Methods for the electrochemical deposition of copper onto a barrier layer of a work piece (2008-07-29),

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Location History:

Company Filing History:

Years Active: 2008-2012