The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 21, 2010
Filed:
Mar. 05, 2007
Jonathan Reid, Sherwood, OR (US);
Seyang Park, Beaverton, CA (US);
Seshasayee Varadarajan, Lake Oswego, OR (US);
Natalia Doubina, Portland, OR (US);
Jonathan Reid, Sherwood, OR (US);
Seyang Park, Beaverton, CA (US);
Seshasayee Varadarajan, Lake Oswego, OR (US);
Natalia Doubina, Portland, OR (US);
Novellus Systems, Inc., San Jose, CA (US);
Abstract
A two-step semiconductor electroplating process deposits copper onto wafers coated with a semi-noble metal in manner that is uniform across the wafer and free of voids. A plating bath nucleates copper uniformly and conformably at a high density in a very thin film. A second bath fills the features. A unique pulsed waveform enhances the nucleation density and reduces resistivity of the very thin film deposited in the nucleation operation. The process produces a thinner and conformal copper seed film than traditional PVD copper seed processes.