Location History:
- Hwasung, KR (2015)
- Asan-si, KR (2018)
- Chungcheongnam-do, KR (2021 - 2023)
Company Filing History:
Years Active: 2015-2023
Title: Seungjin Cheon: Innovator in Package-on-Package Technology
Introduction
Seungjin Cheon is a prominent inventor based in Chungcheongnam-do, South Korea. He has made significant contributions to the field of electronics, particularly in the development of advanced packaging technologies. With a total of 4 patents to his name, Cheon is recognized for his innovative approaches to manufacturing processes.
Latest Patents
One of Cheon's latest patents is a method of manufacturing a package-on-package device, which includes a bonding apparatus that utilizes a pressing member and a laser beam light source. This method involves several steps, starting with the provision of a bottom package that consists of a lower substrate, lower solder balls, and a lower chip. The bottom package is then bonded to an interposer substrate that has upper solder balls aligned with the lower solder balls. Subsequently, a top package, which includes an upper substrate and an upper chip, is bonded to the interposer substrate. During this process, the pressing member applies pressure to the interposer substrate against the bottom package, while the laser beam facilitates the adhesion of the lower solder balls to the upper solder balls.
Career Highlights
Seungjin Cheon is currently employed at Samsung Electronics Co., Ltd., where he continues to push the boundaries of technology in the electronics sector. His work has been instrumental in enhancing the efficiency and effectiveness of package-on-package devices, which are crucial for modern electronic applications.
Collaborations
Throughout his career, Cheon has collaborated with notable colleagues, including Junho Cho and Ohchul Kwon. These partnerships have fostered a creative environment that has led to the development of innovative solutions in the field.
Conclusion
Seungjin Cheon is a key figure in the advancement of package-on-package technology, with a focus on innovative manufacturing methods. His contributions to the field are significant, and his work at Samsung Electronics Co., Ltd. continues to influence the future of electronics.