The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2018
Filed:
Dec. 29, 2015
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventor:
Seungjin Cheon, Asan-si, KR;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); B29C 45/34 (2006.01); B29C 33/10 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
H01L 21/565 (2013.01); B29C 33/10 (2013.01); B29C 45/34 (2013.01); B29L 2031/3406 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/181 (2013.01);
Abstract
The inventive concepts provide an apparatus for manufacturing a semiconductor package and a method for manufacturing a semiconductor package using the same. The apparatus includes a mold unit with a cavity formed by an inner space of the mold unit. The mold unit includes a first mold, a second mold coupled to the first mold, a supply part supplying a molding resin into the cavity, and a vent part disposed to be opposite to the supply part. The vent part includes a first vent part fixed in the mold unit, and a second vent part movable with respect to the first vent part.